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Example of reflow profile using Lead Free solder paste with liquidus temperature of 220°C. Note, the temperature in the graph below is the temperature of theADRV9001 Soldering / Reflow Profile · Laser cut stencil with electropolished walls is recommended. · Aperture size to PCB pad size is typically 1:1 ratio with . 11 Optimizing a Reflow Profile Via Defect Mechanisms Analysis D. Schoenthaler, ''Solder Joining and Fusing with Radiant. Heating'', Assembly & Joining Reflow soldering is the primary method for intercon- necting surface mount technology (SMT) applications. Successful implementation of this process depends The hybrid can be easily soldered to the board using industry standard solder reflow techniques. The typical minimum and maximum temperature profiles used to The solder paste reflows in a molten state, creating permanent solder joints. Heating may be accomplished by passing the assembly through a reflow oven, under